Technical Capacity
PCB Materials: FR-4,Aluminim-base,Rogers Applications
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Backplane & Enclosures Production and Integration
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Complete custom Backplane interconnect capability including:
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Back-plane Design
PCB Artwork
- Follow the design rules determined at Upfront Engineering
- Follow the result of simulation and our long term experience
- Maximum pattern length
- Minimum Pattern gap, width, curving
- Best lay-up structure
- Termination
- Consider Power Distribution
- Consider productivity of PCB
Assembly design
- Selection of Most Productive parts and its layout on PCB
- Best power supply routing to each DC slots and parts
- Best guide pin layout and supporting method for stable mating
For Multi-Giga Bit data transmission speed
- High performance material (low dielectric constant)
- Improvement at difficulty at supply and Cost
- Improvement at PCB productivity
- New Lay-up technology to laminate normal material and High performance material
- High performance connector for more than 5Gbps signal speed (ex. Gbx)